HDO Blue Polishing Pad with CCS Technology 3.5" x 1"

Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS Technology™ solves this common problem using strategic patterns of partially closed foam cells. Now available on our Heavy Duty Orbital (HDO) pads, giving the operator the added benefit of the durable, dual-layer design and tapered edge.

Benefits:

• Correction - Blue pads are used for Heavy defects, harder paint surfaces, and deep etching. Use with medium to heavy cutting compounds.
• Slow Rate of Polish Absorption – CCS pockets gradually release polish as needed by the operator.
• Prevents Pad Skipping – CCS pockets reduce surface tension, allowing the operator to run the pad flat on the working surface.
• Dual Layer – The dual-layer design reduces lateral/horizontal movement, resulting in a reduction of friction inside the pad, which increases durability by eliminating excessive heat and reducing foam fatigue.
• Fits Backing Plate: 3"

Specifications:

• Type: Buffers & pads